Epijing factory teamed up with lighting manufacturers to attack CSP LED packaging factory role micro

Light-emitting diode (LED) packaging plants will become increasingly marginalized in the ecosystem. In order to reduce the manufacturing cost and miniaturize the chip size, the upstream LED die factory competes to develop the chip scale package (CSP) technology layout, and the technology omits the packaging process, so that the future operation mode of the epitaxial plant will skip the package. The factory, directly working with downstream luminaire systems companies, has led to a significant decline in the importance of packaging plants in the supply chain.

NPD DisplaySearch analyst Yan Qingwei said that under the mainstream of unpackaged LED technology, the LED chip factory is more prominent in Evergrande, and accelerates the movement of market forces.

NPD DisplaySearch analyst Yan Qingwei said that Samsung (Samsung), Cree (Cree), Philips Lumileds, Nichia, Toshiba, Jingyuan Optoelectronics, Ronda and other LED die suppliers have invested in CSP technology R&D, in addition to the CSP has been the trend of the times, also announced that the LED ecosystem will change.

CSP is also the common architecture of unpackaged LED technology; other mainstream architectures without packaged LED technology include ELC (Embedded LED Chip) developed by Epistar and PoD (Phosphor on die) of TSMC, regardless of CSP, ELC or PoD, after the production of the LED die, eliminates the steps of the lead frame and the wire, and can be directly introduced into the lamp system.

Yan Qingwei pointed out that because there is no lead frame for unpackaged LED technology, it has the characteristics of smaller size, lower cost and higher illumination angle. The call for the mainstream technology of the next generation LED market is extremely high, and therefore attracts many LED chips. Manufacturers are scrambling to expand the layout to take the lead in the market.

In fact, unpackaged LED technology has been around for many years. However, in the past, LED technology has not matured, resulting in luminous efficiency still not meeting the lighting market requirements, and it has not become a climate. After the LED luminous efficiency exceeded 130lm/W, the commercialization of unpackaged LED technology was also seen.

Yan Qingwei estimates that from the blueprint of product development of various LED chip manufacturers, more unpackaged LED technology products will bloom everywhere in the second half of 2014; especially after Taiwanese grain manufacturers join the war, the cost advantage is expected. The market for unpackaged LED technology has expanded rapidly.

As more LED chip makers enter the unpackaged technology market, LED packaging companies are increasingly weakening their supply chain roles, while making the LED industry's larger Evergrande situation more significant. Yan Qingwei believes that unpackaged LED technology is mainly in the hands of upstream grain manufacturers, coupled with high technical thresholds. If large-scale and good-quality LED die suppliers are difficult to invest in the long-term, it is expected that the LED die market will be the largest. The situation is getting worse.

In view of this, for the thick enterprise resources and competitiveness, the merger and acquisition case between LED die factories will also emerge in an endless stream, and the weak manufacturers will also become the fate of being acquired or eliminated.

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