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Figure 1 Embedded metal heat sink high thermal conductivity substrate MCOB
Figure 2 Multi-layered package substrate COB
Figure 3 Guangdong Province Key New Product Certificate
(This article is based on Guoxing Optoelectronics submission)
September 29, 2024
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September 29, 2024
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.